A client approached us with a difficult electronics packaging problem. Their customer required a commercial, off-the-shelf (COTS) board to be included in a device that must pass the MilSpec random response envelope for a particular aircraft. Since the COTS board could not survive the vibration unless the enclosure provided shock and vibration isolation, the objective of the analysis was to specify the required properties for the enclosure supports as well as to ensure that the enclosure itself had sufficient fatigue life to survive the vibration spectrum.
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